Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future

Quick Summary:

"Accelsius and The Media Content University of Texas at Arlington are advancing important work under the COOLERCHIPS program, and I’m excited to see the impact this collaboration will have on US leadership in next-generation data center efficiency.” "It’s an exciting opportunity to collaborate with fellow thermal experts from across the industry,” said Dr.

"We invite anyone attending the upcoming ITherm event to join us at the lab for an in-person tour and deeper understanding of the project and technologies involved.” The COOLERCHIPS (Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems) program aims to transform how high-density data centers are cooled.

The project, "Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,” will develop a next-generation hybrid architecture that combines direct-to-chip evaporative cooling with air-based solutions such as rear door heat exchangers.

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Author / Journalist: Accelsius

Category: Technology

Markets: China

Topics: Nasdaq:INV US45784M1080

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2025-05-22 @ 11:00:00 (14 hours ago)

News Timezone: GMT +8:00

News Source URL: globenewswire.com

Language: English

Article Length: 459 words

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News ID: 28904450

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